Samsung Reportedly Developing 3-Layer Stacked Image Sensor for Apple

Samsung is purportedly developing a 3-layer stacked image sensor for Apple, in an effort to compete with Sony, Apple's long-time sensor supplier.

In a post on X, leaker Jukanlosreve, claims that sensor is more advanced than Sony's existing Exmor RS sensor and could even be considered for the iPhone's main camera.

Exclusive: Samsung is currently developing a "3-layer stacked" image sensor in a PD-TR-Logic configuration for Apple. This sensor is more advanced than Sony's existing Exmor RS, and I believe it cannot be ruled out as a potential candidate for the main sensor.


Notably, the leaker also says that the company is working on a 500MP sensor for its own Galaxy devices.

Samsung's work on a sensor for Apple has been previously reported by multiple sources, including TF International Securities analyst Ming-Chi Kuo. In July, Kuo stated that Samsung is expected to begin shipping 1/2.6-inch 48MP ultra-wide CMOS image sensors (CIS) to Apple for iPhones as early as 2026, breaking Sony's years-long monopoly on supplying CIS to Apple.

If accurate, this move could help Apple diversify its supply chain, reducing reliance on a single supplier and potentially lowering component costs. Please download the iClarified app or follow iClarified on Twitter, Facebook, YouTube, and RSS for additional updates.