Apple's Next-Gen M5 Pro, Max, and Ultra Chips Could Adopt Separate CPU and GPU Designs

Apple's next generation M5 Pro, M5 Max, and M5 Ultra chips could adopt separate CPU and GPU designs, according to a new report from TF International Securities analyst Ming-Chi Kuo.

In a post on X today, Kuo predicts that Apple will use TSMC's advanced N3P node for its M5 series of chips. The chips purportedly entered the prototype phase a few months ago with mass production expected in 1H25, 2H25, and 2026 for the M5, M5 Pro/Max, and M5 Ultra, respectively.

The M5 Pro, Max, and Ultra will utilize server-grade SoIC packaging. Apple will use 2.5D packaging called SoIC-mH (molding horizontal) to improve production yields and thermal performance, featuring separate CPU and GPU designs.


Kuo also predicts that Apple's PCC (private cloud compute) infrastructure build-out will accelerate after the mass production of the high-end M5 chips, better suited for AI inferencing.

By designing the CPU and GPU as separate dies within a single package, Apple gains better yields, enhanced thermals, scalability, and the flexibility to tailor performance more precisely. For example, it could scale the number of CPU or GPU chiplets for difference product lines.

Finally, Kuo says that BESI's hybrid bonding equipment will benefit from Apple's use of SoIC packaging for its high-end M5 chips.

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