Chipworks Tears Down the New iPhone 7, Identifies Components [Photos]

Chipworks has posted its teardown of the iPhone 7 revealing more detail on the components used in Apple's new smartphone.

Highlights:
● We have indeed found an entire Intel mobile cellular platform inside the iPhone 7. Intel supplied not just one, but two RF transceivers, the baseband modem, and the (RF) power management IC.
● The Apple A10 processor in our iPhone 7 is a TSMC chip
● Apple’s part number for the A10 is APL1W24, 339S00255
● The A10 processor is incredibly thin, giving credibility to the reports that TSMC’s InFO packaging technique is being used.
● The A10 sits below the Samsung K3RG1G10CM 2-GB LPDDR4 memory.
● SK Hynix H23Q1T8QK2MYS 128-GB part with EMI shielding, fabricated in 15-nm technology. Another device has Toshiba THGBX6T0T8LLFXE 128 GB NAND memory IC also fabricated on 15 nm.
● The Touch Controller for the iPhone 7 is manufactured by Universal Scientific Industries (USI) with markings O1 1R.
● NXP NFC Controller with package markings 67V04 (likely PN67V)
● The WiFi / Bluetooth socket has been won by Murata with a module part number 339S00199.
● We found not just 2 but 3 Audio Amplifiers - we speculate there is one audio amplifier for for each of the two speakers, and the third amplifier is for the headphone via the Lightning port.

Much more detail can be found in the full teardown linked below. Please follow iClarified on Twitter, Facebook, or RSS for updates.


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