Apple A18 and A18 Pro Die Shots [Images]

Check out these die shots of the new Apple A18 and A18 Pro chips, featured in the iPhone 16 and iPhone 16 Pro. The images were captured and shared by ChipWise as part of their upcoming smartphone teardown analysis.

The packaging technique has remained consistent over the years, with TSMC utilizing the InFO-PoP (Integrated Fan-Out Package-on-Package) method. This approach stacks the DRAM package directly on top of the SoC die and incorporates high-density RDL (Redistribution Layers) along with TIV (Through InFO Via) to reduce the overall chip size while ensuring strong thermal and electrical performance. A key advantage of this technique is its flexibility, as the DRAM package can be easily swapped or replaced.

A18 Chip
• Built on TSMC's 3nm (N3E) process for better performance and power efficiency.
• 6-core CPU with 2 high-performance cores and 4 high-efficiency cores.
• Features a 5-core GPU optimized for gaming, AR, and high-resolution tasks.
• Uses InFO-PoP packaging for improved thermal and electrical performance.



[A18]

A18 Pro Chip
• Also manufactured on the 3nm process, but optimized for higher speeds and demanding tasks.
• 6-core CPU, similar to the A18, but tuned for better processing performance in video editing and gaming.
• 6-core GPU, providing enhanced graphics for 3D rendering, AR, and other intensive tasks.
• Upgraded Neural Engine with more cores for advanced AI and machine learning tasks.

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[A18 Pro]