Apple is purportedly testing an image sensor from Samsung for the iPhone 16, according to a new report from The Elec. The image sensor is intended for use on the main camera of the company's next generation smartphone.
So far Apple has always used Sony image sensors, but it is looking to add Samsung to ensure an adequate supply of sensors.
Cupertino requested that Samsung start the development of the image sensor late last year, they said, after the Japanese tech giant failed to supply image sensors in a timely fashion. This caused Apple to have a difficult time setting a launch date for iPhone 15, they said. If Samsung passes the quality test, which is highly likely, it will be the first time that it is supplying CIS for iPhones.
It's likely that Sony will remain the primary supplier of image sensors for Apple, even if Samsung is added to the supply chain.
According to the report, the new iPhone CIS will be made by stacking three wafers on a copper pad through wafer-to-wafer hybrid bonding. Additionally, each of the three wafers will feature the photodiode, transistors, and analog digital converter logics. Previous sensors only used two wafers and the photodiode and transistors were on a single wafer.
In a CMOS Image Sensor (CIS), each pixel consists of a photodiode and four transistors. The photodiode's role is to convert light into electrical signals, while the transistors are responsible for transferring, amplifying, reading, and erasing these signals. By separating the photodiode from the transistors, high-density pixels can be created. This separation reduces noise and allows for the production of even smaller pixels. Hybrid bonding technology improves this process further by directly attaching the wafers through a copper pad, eliminating the need for signal-transferring bumps. This method makes the CIS more compact and significantly increases the data transfer speed between the components.
Apple is widely expected to launch its new iPhone 16 lineup this fall. Please download the iClarified app or follow iClarified on Twitter, Facebook, YouTube, and RSS for more iPhone updates!
So far Apple has always used Sony image sensors, but it is looking to add Samsung to ensure an adequate supply of sensors.
Cupertino requested that Samsung start the development of the image sensor late last year, they said, after the Japanese tech giant failed to supply image sensors in a timely fashion. This caused Apple to have a difficult time setting a launch date for iPhone 15, they said. If Samsung passes the quality test, which is highly likely, it will be the first time that it is supplying CIS for iPhones.
It's likely that Sony will remain the primary supplier of image sensors for Apple, even if Samsung is added to the supply chain.
According to the report, the new iPhone CIS will be made by stacking three wafers on a copper pad through wafer-to-wafer hybrid bonding. Additionally, each of the three wafers will feature the photodiode, transistors, and analog digital converter logics. Previous sensors only used two wafers and the photodiode and transistors were on a single wafer.
In a CMOS Image Sensor (CIS), each pixel consists of a photodiode and four transistors. The photodiode's role is to convert light into electrical signals, while the transistors are responsible for transferring, amplifying, reading, and erasing these signals. By separating the photodiode from the transistors, high-density pixels can be created. This separation reduces noise and allows for the production of even smaller pixels. Hybrid bonding technology improves this process further by directly attaching the wafers through a copper pad, eliminating the need for signal-transferring bumps. This method makes the CIS more compact and significantly increases the data transfer speed between the components.
Apple is widely expected to launch its new iPhone 16 lineup this fall. Please download the iClarified app or follow iClarified on Twitter, Facebook, YouTube, and RSS for more iPhone updates!