A new report from UDN claims that Apple plans to introduce an under-display ultrasonic fingerprint scanner for the next generation iPhone.
The site claims that Apple will discuss production capacity, yield, price, and other details at a high-level visit to the GIS Chengdu factory next week.
[iThe fingerprint recognition under the ultrasonic screen can achieve the thinnest materials and the highest accuracy, which is better than the fingerprint recognition under the optical screen. Samsung has introduced two flagship machines this year, S10 and Note 10, and cooperates with GIS. Apple considers that GIS is a major partner of Hon Hai Group, has a sound financial status, is a reference designer of Qualcomm ultrasonic fingerprint recognition, and has Samsung's flagship machine cooperation experience. Regardless of capacity and yield, it meets mass production conditions, so it turned to GIS.
Qualcomm is the leader in development of under-display ultrasonic fingerprint recognition. Today at the Snapdragon Tech Summit, the company announced the 3D Sonic Max, the latest version of its ultrasonic fingerprint sensor. 3D Sonic Max offers a recognition area that is 17x larger than the previous generation, allowing for increased security via simultaneous two-finger authentication, increased speed and ease of use.
Now that Apple has a reached an agreement with Qualcomm and a six-year license agreement, perhaps we'll see more than just a Qualcomm modem in the next generation iPhone.
Please download the iClarified app or follow iClarified on Twitter, Facebook, YouTube, and RSS for updates.
Read More
The site claims that Apple will discuss production capacity, yield, price, and other details at a high-level visit to the GIS Chengdu factory next week.
[iThe fingerprint recognition under the ultrasonic screen can achieve the thinnest materials and the highest accuracy, which is better than the fingerprint recognition under the optical screen. Samsung has introduced two flagship machines this year, S10 and Note 10, and cooperates with GIS. Apple considers that GIS is a major partner of Hon Hai Group, has a sound financial status, is a reference designer of Qualcomm ultrasonic fingerprint recognition, and has Samsung's flagship machine cooperation experience. Regardless of capacity and yield, it meets mass production conditions, so it turned to GIS.
Qualcomm is the leader in development of under-display ultrasonic fingerprint recognition. Today at the Snapdragon Tech Summit, the company announced the 3D Sonic Max, the latest version of its ultrasonic fingerprint sensor. 3D Sonic Max offers a recognition area that is 17x larger than the previous generation, allowing for increased security via simultaneous two-finger authentication, increased speed and ease of use.
Now that Apple has a reached an agreement with Qualcomm and a six-year license agreement, perhaps we'll see more than just a Qualcomm modem in the next generation iPhone.
Please download the iClarified app or follow iClarified on Twitter, Facebook, YouTube, and RSS for updates.
Read More