A printed circuit board (PCB) for the iPhone 7 has allegedly been leaked by GeekBar and MGFIX.
The PCB will hold the expected A10 processor and other chips used to form the iPhone's logic board.
With Apple's launch of the next generation iPhone just a month away we should be seeing leaks come in at an even higher rate.
It's widely expected that the iPhone 7 will feature simplified antenna bands, a larger camera, no headphone jack, and a second speaker for stereo audio. The iPhone 7 Plus is expected to get a dual lens camera for better zoom, 3GB of RAM, and possibly a Smart Connector. Other predictions for both devices include water proofing, a new space black color, and a Force Touch Home button with haptic feedback.
Please follow iClarified on Twitter, Facebook, or RSS for further updates.
[via @stagueve]
The PCB will hold the expected A10 processor and other chips used to form the iPhone's logic board.
With Apple's launch of the next generation iPhone just a month away we should be seeing leaks come in at an even higher rate.
It's widely expected that the iPhone 7 will feature simplified antenna bands, a larger camera, no headphone jack, and a second speaker for stereo audio. The iPhone 7 Plus is expected to get a dual lens camera for better zoom, 3GB of RAM, and possibly a Smart Connector. Other predictions for both devices include water proofing, a new space black color, and a Force Touch Home button with haptic feedback.
Please follow iClarified on Twitter, Facebook, or RSS for further updates.
[via @stagueve]