Apple suppliers are preparing parts and components for the production of up to 80 million iPhone 6 & iPhone 6 Plus units before the year's end, reports DigiTimes.
Apple aims to ship 80 million units of the iPhone 6-series products before the end of 2014, higher than the 60 million units of the iPhone 5 shipped in 2013, the sources indicated. Barring the occurrence of component shortages and low yield rates, shipments of the iPhone 6s should be able to reach 10 million units by the end of September and total 60-70 million in the fourth quarter, the sources estimated.
DigiTimes also listed some of the suppliers in the iPhone 6 chain. Those include: Taiwan Semiconductor Manufacturing Company (A8 processors); Catcher Technology and Foxconn Technology (cases); Largan Precision and Genius Electronic Optical (camera modules); Foxconn Electronics and Pegatron (assembly); Simplo Technology (battery); and Delta Electronics (power supply). PCB makers Compeq manufacturing, Unimicron Technology, Zhen Ding Technology Holdings, and Flexium Interconnect, as well as IC packaging/testing companies Advanced Semiconductor Engineering (ASE), King Yuan Electronics (KYEC) and Ardentec.
For more details on the new iPhone 6 and iPhone 6 Plus, click here.
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Apple aims to ship 80 million units of the iPhone 6-series products before the end of 2014, higher than the 60 million units of the iPhone 5 shipped in 2013, the sources indicated. Barring the occurrence of component shortages and low yield rates, shipments of the iPhone 6s should be able to reach 10 million units by the end of September and total 60-70 million in the fourth quarter, the sources estimated.
DigiTimes also listed some of the suppliers in the iPhone 6 chain. Those include: Taiwan Semiconductor Manufacturing Company (A8 processors); Catcher Technology and Foxconn Technology (cases); Largan Precision and Genius Electronic Optical (camera modules); Foxconn Electronics and Pegatron (assembly); Simplo Technology (battery); and Delta Electronics (power supply). PCB makers Compeq manufacturing, Unimicron Technology, Zhen Ding Technology Holdings, and Flexium Interconnect, as well as IC packaging/testing companies Advanced Semiconductor Engineering (ASE), King Yuan Electronics (KYEC) and Ardentec.
For more details on the new iPhone 6 and iPhone 6 Plus, click here.
Read More