Sony today announced that it has developed a new next-generation back-illuminated CMOS image sensor.
This image sensor layers the pixel section containing formations of back-illuminated structure pixels onto chips containing the circuit section for signal processing, which is in place of supporting substrates for conventional back-illuminated CMOS image sensors. This structure achieves further enhancement in image quality, superior functionalities and a more compact size that will lead to enhanced camera evolution.
Features of stacked CMOS image sensor
● Large-scale signal processing circuits required for higher image quality and better functionality are built-in
● More compact image sensor chip size
● Even higher image quality of the pixel section by adopting manufacturing processes specialized for superior image quality
● Faster speeds and lower power consumption by adopting the leading process for the circuit section
Sony supplies some of the image sensors for the iPhone 4S, so this technology could make its way to the iPhone 5.
This image sensor layers the pixel section containing formations of back-illuminated structure pixels onto chips containing the circuit section for signal processing, which is in place of supporting substrates for conventional back-illuminated CMOS image sensors. This structure achieves further enhancement in image quality, superior functionalities and a more compact size that will lead to enhanced camera evolution.
Features of stacked CMOS image sensor
● Large-scale signal processing circuits required for higher image quality and better functionality are built-in
● More compact image sensor chip size
● Even higher image quality of the pixel section by adopting manufacturing processes specialized for superior image quality
● Faster speeds and lower power consumption by adopting the leading process for the circuit section
Sony supplies some of the image sensors for the iPhone 4S, so this technology could make its way to the iPhone 5.