OmniVision today introduced the 8-megapixel OV8850, the first CameraChip sensor built on a 1.1-micron OmniBSI-2 pixel architecture. The 1/4-inch OV8850 leads the CMOS sensor pixel design race in the smartphone market by enabling autofocus modules that are 20 percent slimmer than any 8-megapixel module in commercial use today. Besides a small footprint, the 1.1-micron OmniBSI-2 pixel offers significant improvements in power efficiency and image quality comparable to the previous generation 1.4-micron OmniBSI pixel, making it an attractive solution for next-generation smartphones and tablets.
"With our new OmniBSI-2 architecture, we have further miniaturized our pixels while delivering a 20 percent improvement in peak quantum efficiency in all color channels, a 35 percent improvement in low-light sensitivity and a 45 percent increase in full-well capacity in an extremely compact and power efficient package," said Per Rosdahl, senior product manager at OmniVision. "This 1.1-micron OmniBSI-2 pixel enables the next generation of miniaturization in mobile cameras, and is key to the high-resolution smartphone camera roadmap."
Besides its advanced pixel design, the OV8850 also features advanced imaging functions, such as an on-chip temperature sensor, two phase lock loops, context switching, and alternate row exposure for high dynamic range (HDR) video and still image capture. An integrated scaler allows the camera to maintain full field of view in 1080p/30 high-definition (HD) video and preview modes and provides additional adjustable resolution for electronic image stabilization (EIS). The sensor's 2 x 2 binning functionality provides enhanced 720p/60 HD video recording with EIS, an absolute must in today's advanced mobile devices.
The OV8850 fits in an 8.5 x 8.5mm autofocus camera module with a build height of 4.7 mm. Sampling will begin in August, with mass production expected in the first calendar quarter of 2012.
It's unclear if this particular sensor will be available in time for use in the iPhone 5; however, it's widely expected that Apple will use an 8MP camera for the next generation device.
"With our new OmniBSI-2 architecture, we have further miniaturized our pixels while delivering a 20 percent improvement in peak quantum efficiency in all color channels, a 35 percent improvement in low-light sensitivity and a 45 percent increase in full-well capacity in an extremely compact and power efficient package," said Per Rosdahl, senior product manager at OmniVision. "This 1.1-micron OmniBSI-2 pixel enables the next generation of miniaturization in mobile cameras, and is key to the high-resolution smartphone camera roadmap."
Besides its advanced pixel design, the OV8850 also features advanced imaging functions, such as an on-chip temperature sensor, two phase lock loops, context switching, and alternate row exposure for high dynamic range (HDR) video and still image capture. An integrated scaler allows the camera to maintain full field of view in 1080p/30 high-definition (HD) video and preview modes and provides additional adjustable resolution for electronic image stabilization (EIS). The sensor's 2 x 2 binning functionality provides enhanced 720p/60 HD video recording with EIS, an absolute must in today's advanced mobile devices.
The OV8850 fits in an 8.5 x 8.5mm autofocus camera module with a build height of 4.7 mm. Sampling will begin in August, with mass production expected in the first calendar quarter of 2012.
It's unclear if this particular sensor will be available in time for use in the iPhone 5; however, it's widely expected that Apple will use an 8MP camera for the next generation device.